Data-center two-phase immersion cooling fluid and precision-cleaning solvent. Boiling point 50°C · low GWP · no flash point. A low-GWP replacement for the 3M Novec discontinued in 2025, supplied in Korea by authorized distributor Wholesale Industry.
Under PFAS regulation, 3M ended production of Novec and Fluorinert after taking its last orders in March 2025. Novec had been the standard fluid, holding roughly 80% of the data-center two-phase immersion cooling and semiconductor-cleaning coolant market, and its exit — coinciding with surging AI data-center demand — has opened a supply gap for replacement cooling fluids. HFMOP is the low-GWP fluorinated fluid that fills this gap.
HFMOP's decisive cooling-efficiency advantage over competing fluids, per HQ data.
| Chemical name | Hexafluoro-2-methoxypropane |
| CAS | 13171-18-1 |
| Molecular formula / Molecular weight | C₄H₄F₆O / 182 |
| Boiling point | 50°C |
| Freezing point | -78°C |
| Density | 1.38 g/mL |
| Viscosity (23°C) | 0.36 cSt |
| Flash point | None (nonflammable) |
| Latent heat of vaporization | 179 kJ/kg |
| ODP / GWP | 0 / Low |
| TLV | 650 ppm |
| Nonvolatile residue | 0.0 mg/100mL |
| Property | HFMOP | Novec 7100 | Vertrel XF | Novec 1230 |
|---|---|---|---|---|
| Boiling point °C | 50 | 61 | 55 | 49 |
| Latent heat of vaporization kJ/kg | 179 | 126 | 130 | 88 |
| KB value (cleaning power) | 16 | 10 | 5 | — |
| Flash point | None | None | None | None |
HFMOP ranks first in both latent heat of vaporization (cooling efficiency) and KB value (cleaning power), and it is a low-GWP fluorinated fluid, especially advantageous for two-phase immersion cooling that relies on phase-change cooling efficiency.
Servers are immersed directly in the fluid; the heat makes the fluid boil and vaporize, then a condenser returns it to liquid in a continuous two-phase cooling loop. With a boiling point of 50°C and latent heat of vaporization of 179 kJ/kg, HFMOP efficiently absorbs the heat of high-density AI racks, and its high dielectric strength allows electronics to be immersed directly. Being nonflammable, it also meets data-center fire-safety requirements.
With a high KB value of 16 for cleaning power plus 0.0 nonvolatile residue, it is used for precision cleaning of semiconductors and electronic components, vapor degreasing, anti-fouling coating carrier, and as a dilution/dispersion solvent. Compatible with ABS, PC, Epoxy, Phenol, PEEK, PTFE and PU (no change after 24-hour immersion); acrylic requires review.
Other applications — thermal-transfer medium and reliability testing, fire-protection fluid, and drainage solvent. If you need single-phase immersion cooling, also consider the PCTFE-based Halocarbon 0.8 / 1.8 Oil.
Tell us the cooling/cleaning fluid you have been using and your process conditions (heat load, rack density, temperature, materials), and we'll respond with an HFMOP suitability review plus a sample and quote. Genuine product supplied direct from HQ, with TDS/MSDS provided.
